Labels Milestones
BackFPGA Maxim WLP-12, W121H2+1, 2.008x1.608mm, 12 Ball, 4x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l562ce.pdf ST WLCSP-90, ST die ID 472, 4.36x4.07mm, 81 Ball, 9x9 Layout.
- Tweaks layout with input.
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Groundplane 82024e96c9b263a83b6caf715e8607e9cf1b7d77 updated README.md
- 0.0113627 vertex 1.06598 -6.91995 10.3435.