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3.90 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (http://www.ti.com/lit/ds/symlink/cdclvp1102.pdf#page=28), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-10DP-0.5V, 10 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 28 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=338), generated with kicad-footprint-generator Soldered wire connection, for 6 times 0.15 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-140-02-xx-DV-TE, 40 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package (8MA2) - 2x3x0.6 mm.

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