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KnobDiameter = 20; shaft_is_flatted = true; set_screw_radius = 1.5; // // knob_radius_top = 10; // Center two holes hole_r = 1.7; // Hole for setscrew } // h[p] function hp_mm(h) = h * HP; Panels/10_step_seq_38hp_v2.scad Normal file Unescape Hardware/PCB/precadsr_Gerbers/precadsr-F_SilkS.gbr Normal file Unescape Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Bourns_3296W_Vertical_screw_centered.kicad_mod Normal file Unescape Hardware/PCB/precadsr/precadsr.pro Normal file Unescape Hardware/Panel/precadsr_panel_al/precadsr_panel_al.pretty/precadsr-panel-art.kicad_mod Normal file View File 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/BLADE BARRIER.png Normal file Unescape "Name": "Top Solder Paste" "Name": "Bottom Solder Mask" "Name": "Bottom Solder Mask" "Name": "Bottom Silk Screen" Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib Normal file Unescape // 10 steps based on http://www.latticesemi.com/view_document?document_id=213 BGA 0.8mm 9mm 121 BGA-132 11x17 12x18mm 1.0pitch Altera BGA-144 M144 MBGA Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.5mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.5mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster, 3.141x3.127mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.4mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f429ng.pdf WLCSP-143, 11x13 raster, 4.521x5.547mm package, pitch 0.4mm; see section 7.8 of http://www.st.com/resource/en/datasheet/DM00387108.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/dac80508.pdf Analog LFCSP, 16 Pin (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf#page=266), generated with kicad-footprint-generator Molex LY 20 series connector, SM02B-SHLS-TF (http://www.jst-mfg.com/product/pdf/eng/eSHL.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 18 Pin (JEDEC MO-153 Var GD https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 5 times 0.1 mm² wire, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.6mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 0.15 mm² wires, reinforced insulation, conductor diameter 0.4mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST ZE series connector, B20B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST SH series connector, S12B-XH-A-1 (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py ON Semi DFN5 5x6mm 1.27P SO-8FL CASE 488A ON Semiconductor.

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