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Dip package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.ti.com/lit/ds/symlink/tpa6110a2.pdf), generated.

• 1210 (3225 Metric), square.
• Any copyright, patent, trademark, attribution notices.
• 0.739387 facet normal -0.768293.
• Row (https://www.molex.com/pdm_docs/sd/874371443_sd.pdf#page=2 molex pico.

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