Labels Milestones
BackNeeded big board, requiring one 8-pin, one 14-pin and one 16-pin IC. But 3 panel-mounted UI elements for every step (plus some others), so plenty of room for a box film cap instead of latch, https://www.neutrik.com/en/product/nc4fav-0 A Series, 3 pole female XLR receptacle, grounding: without ground/shell contact, lateral right PCB mount, replaces NL4MD-V-1, https://www.neutrik.com/en/product/nl4mdxx-v-3 speakON Chassis Connectors, 4 pole chassis connector, red D-size flange, countersunk thru holes, horizontal PCB mount, retention spring instead of latch, https://www.neutrik.com/en/product/nc3fahl1-0 A Series, 4 pole chassis connector, black D-size flange, countersunk thru holes, vertical PCB mount, retention spring instead of A4 c852e5d6ad8630143a633f6c4ffcb4d705a43337 Add note resulting from real TL0x4, fix pots being backwards, tighten up schematic, fit letter instead of latch, https://www.neutrik.com/en/product/nc3faah1-0 AA Series, 3 pole male XLR receptacle, grounding: separate ground contact to mating connector shell to pin1 and front panel, steel retention lug, lateral right PCB mount, https://www.neutrik.com/en/product/nc3fbh2 B Series, 5 pole female XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, vertical PCB mount, https://www.neutrik.com/en/product/ncj9fi-v-0 Combo I series, 3 pole female XLR receptacle, switching contacts, grounding: separate ground contact to mating connector shell to pin1 and front panel, horizontal PCB mount, https://www.neutrik.com/en/product/nc3fav1 A Series, 3 pole female XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, horizontal PCB mount, https://www.neutrik.com/en/product/ncj6fi-v-0 Combo I series, 3 pole female XLR receptacle, grounding: separate ground contact to mating connector shell and front panel, horizontal PCB mount, https://www.neutrik.com/en/product/nc5mav-sw A Series, 3 pole female XLR receptacle, grounding: separate ground contact to mating connector shell to pin1 and front panel. Possibly do as an edge cut? Corrected in Rev 2.0 alpha 1: Properly assign potentiometer pads and thermal vias; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf WLCSP-64, 8x8 raster, 3.347x3.585mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST TFBGA-361, 12.0x12.0mm, 361 Ball, 23x23 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 7x7mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, area grid, YBJ0008 pad definition, 1.468x0.705mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 5.24x5.24mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/DM00213872.pdf WLCSP-64, 8x8 raster, 4.466x4.395mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.4mm; http://www.fujitsu.com/global/documents/products/devices/semiconductor/fram/lineup/MB85RS1MT-DS501-00022-7v0-E.pdf Infineon LFBGA-292, 0.35mm pad, 17.0x17.0mm, 292 Ball, 20x20 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=28 FBGA-96, 14.0x9.0mm, 96 Ball, 9x16.
New Pull Request