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BGA-68 M68 MBGA Altera VBGA V81 BGA-81 Altera BGA-100 M100 MBGA 121-ball, 0.8mm BGA (based on standard DIP-4), row spacing 5.08 mm (200 mils), body size 10.8x4.1mm DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/209-210.pdf), LowProfile 6x-dip-switch SPST , Slide, row spacing 25.24 mm (993 mils SMD DIP DIL PDIP 2.54mm 7.62mm 300mil Socket LongPads 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), https://toshiba.semicon-storage.com/info/docget.jsp?did=1421&prodName=TLP3021(S Toshiba 11-7A9 package, like 6-lead dip package for diode bridges, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 16-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 64-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads THT.

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