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20-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 10x-dip-switch SPST CTS_Series194-10MSTN, Piano, row spacing 7.62 mm (300 mils), body size 10.8x6.64mm 2x-dip-switch SPST , Slide, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL ZIF 10.16mm 400mil Socket 22-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 5.25 mm (206 mils), body size 10.8x6.64mm 2x-dip-switch SPST KingTek_DSHP02TJ, Slide, row spacing 15.24 mm (600 mils 48-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils 42-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils), LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 28-lead though-hole mounted DIP package, row spacing 5.08 mm (200 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 5x-dip-switch SPST Omron_A6S-510x, Slide, row spacing 8.9 mm (350 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 2x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils Analog BGA-28 4.0mm x 6.25mm package, pitch 0.4mm; see section 6.2 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-100, 10x10, 9x9mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.039x3.951mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f378vc.pdf WLCSP-72, 9x9 raster, 4.4084x3.7594mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch.

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