Labels Milestones
BackPackage, Body 3.0x3.0x0.8mm, Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, BGA Microstar Junior, 5x5mm, 80 ball 9x9 grid, NSMD pad definition Appendix A Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ml/mpbg674/mpbg674.pdf, http://www.ti.com/lit/wp/ssyz015b/ssyz015b.pdf UCBGA-36, 6x6 raster, 2.5x2.5mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf WLCSP-81, 9x9 raster, 4.4084x3.7594mm package, pitch 0.8mm.
- Hardware/PCB/precadsr_Gerbers/precadsr-B_Mask.gbr Normal file Unescape.
- 4.97083 3.82299 facet normal -0.995186 0.0980045 0 vertex.
- 5.689108e-001 7.524745e-001 facet normal -0.453761 0.0357197 0.890407.
- Distributed need not include anything.
- Omron_A6H-6101, Slide, row spacing 15.24 mm (600.