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ID 450, 4.96x4.64mm, 156 Ball, 13x12 Layout, 0.35mm Pitch, https://www.st.com/resource/en/datasheet/stm32h725vg.pdf ST WLCSP-115, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x05, 2.54mm pitch, double rows Through hole angled pin header, 1x36, 1.27mm pitch, double rows Through hole straight socket strip, 2x10, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header THT 2x35 1.27mm double row surface-mounted straight pin header, 1x25, 2.00mm pitch, double rows Surface mounted pin header SMD 1x11 1.27mm single row Surface mounted socket strip THT 2x34 1.27mm double row Through hole angled socket strip THT 1x04 1.27mm single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 2x17, 2.54mm pitch.

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