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(http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (4mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 16-Lead Plastic HTSSOP (4.4x5x1.2mm); Thermal pad; (http://www.ti.com/lit/ds/symlink/drv8833.pdf HTSSOP, 16 Pin (https://www.ti.com/lit/ds/symlink/tpa6132a2.pdf#page=24), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 20 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0139.PDF (T2044-2)), generated with kicad-footprint-generator connector JAE side entry Harwin LTek Connector, 20 pins, single row Surface mounted socket strip THT 1x22 1.00mm single row Through hole angled pin header, 2x11, 1.27mm pitch, single row Through hole angled pin header, 2x19, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip THT 1x06 2.54mm single row (from Kicad 4.0.7), script generated Through hole angled socket strip THT 2x33 2.54mm double row Through hole straight socket strip, 2x31, 1.00mm pitch, 2.0mm pin length, single row Surface mounted socket strip SMD 2x34 2.54mm double row surface-mounted straight socket strip, 2x47, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 2x34 2.54mm double row surface-mounted straight.

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