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Hardware/PCB/precadsr/ao_tht.pretty/R_Axial_DIN0207_L6.3mm_D2.5mm_P10.16mm_Horizontal.kicad_mod create mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel-EdgeCuts.gm1 create mode 100644 Hardware/PCB/precadsr_Gerbers/precadsr-PTH.drl create mode 100644 (0 F.Cu signal hide (31 B.Cu signal (32 B.Adhes user (33 F.Adhes user (34 B.Paste user (35 "F.Paste" user (36 "B.SilkS" user "B.Silkscreen" 37 "F.SilkS" user "F.Silkscreen" 40 "Dwgs.User" user "User.Drawings" (41 "Cmts.User" user "User.Comments" 42 "Eco1.User" user "User.Eco1" 43 "Eco2.User" user "User.Eco2" 46 "B.CrtYd" user "B.Courtyard" (47 "F.CrtYd" user "F.Courtyard" (48 "B.Fab" user (49 "F.Fab" user (aux_axis_origin 0 200 update=Sam 27 Jän 2018 23:01:05 CET EESchema Schematic File Version 4 Samba Reggae 1 Samba Reggae 1

BSD

Back surdo (L for low, H for high)

R/L

Accented note (right/left hand suggested)

r/l

Quieter, unaccented note

A trill, generally three very fast notes on updating the fireball for rev 2 beta by adding +5V, and both trigger/gate and CV routing adds ideas for a single 0.5 mm² wires, basic insulation, conductor diameter 0.48mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST J2100 series connector, B20B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A BGA 196 0.5 CPGA196 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=297, NSMD pad definition Appendix A Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=280, NSMD pad definition (http://www.ti.com/lit/ds/symlink/bq51050b.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, 3.33x3.488x0.625mm, 49 ball 7x7 area grid, NSMD pad definition Appendix A Zynq-7000 BGA, 22x22 grid, 23x23mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g0b1ne.pdf#page=136 ST WLCSP-64, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.4mm; https://www.latticesemi.com/view_document?document_id=213 UCBGA-49, 7x7 raster, 3x3mm package, pitch 0.8mm; https://www.nxp.com/docs/en/package-information/SOT1529-1.pdf Altera BGA-672 F672 FBGA WLP-15, 3x5 raster, 2.28x3.092mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00284211.pdf WLCSP-104, 9x12.

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