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Variant of 8-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 42-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 10-lead though-hole mounted DIP package, row spacing 15.24 mm (600.

• 0.55371 facet normal 0.115649 0.00128232 0.993289.
• Connector Hirose DF13C SMD, CL535-0407-6-51, 7.
• -0.392055 -0.2628 0.881606 facet normal -9.916058e-01 1.292925e-01.

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