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8pin Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments CSD18531Q5A http://www.ti.com/lit/ds/symlink/csd18531q5a.pdf WSON, 6 Pin (https://docs.broadcom.com/docs/AV02-4755EN), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for a single 0.25 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 3.5mm, size source Multi-Contact FLEXI-E 0.1 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 5 times 2 mm² wire, basic insulation, conductor diameter 1.4mm, outer diameter 1.7mm, outer.

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