synth_tools

Back

5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-2/ Infineon, PG-TISON-8-4, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-2/ Infineon, PG-TISON-8-4, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-2/ Infineon, PG-TISON-8-4, 5x6x1.15mm, 1.27mm Pitch, Exposed Paddle, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-4/ Infineon, PG-TISON-8-5, 8x8x1.1mm, 1mm Pitch, https://www.infineon.com/cms/en/product/packages/PG-TISON/PG-TISON-8-5/ VML0806, Rohm (http://rohmfs.rohm.com/en/techdata_basic/transistor/soldering_condition/VML0806_Soldering_Condition.pdf, http://rohmfs.rohm.com/en/products/databook/package/spec/discrete/vml0806_tr-e.pdf MicroCrystal C3 2.5x3.7mm, https://www.microcrystal.com/fileadmin/Media/Products/RTC/Datasheet/RV-1805-C3.pdf SON, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23), generated with kicad-footprint-generator crystal Epson Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128⟨=en), 2x1.6mm^2 package SMD Crystal EuroQuartz MQ series http://cdn-reichelt.de/documents/datenblatt/B400/MQ.pdf, hand-soldering, 7.0x5.0mm^2 package SMD Crystal HC-49-SD http://cdn-reichelt.de/documents/datenblatt/B400/xxx-HC49-SMD.pdf, 11.4x4.7mm^2 package SMD Crystal SERIES SMD2520/2 http://www.icbase.com/File/PDF/HKC/HKC00061008.pdf, hand-soldering, 5.0x3.2mm^2 package SMD Crystal Qantek QC5CB, https://www.qantek.com/tl_files/products/crystals/QC5CB.pdf crystal Epson Toyocom FA-128 (https://support.epson.biz/td/api/doc_check.php?dl=brief_FA-128&lang=en), 2x1.6mm^2 package SMD SMT SPST EVQPUM EVQPUD SMD 1x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 6.7x9.18mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/204.pdf), SMD SMD 4x-dip-switch SPST Copal_CVS-04xB, Slide, row spacing 7.62 mm (300 mils), SMDSocket, LongPads 64-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 14-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf THT DIP DIL PDIP 2.54mm 7.62mm 300mil Socket 4-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 10.16mm 400mil Socket 3M 24-pin zero insertion force socket, through-hole, row spacing 9.53 mm (375 mils 22-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201446313350.pdf), JPin SMD 11x-dip-switch SPST , Slide, row spacing 22.86 mm (900 mils), SMDSocket.

New Pull Request

Labels Milestones