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1x11, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 2x36 1.00mm double row Through hole IDC header, 2x15, 1.00mm pitch, single row Surface mounted socket strip SMD 1x20 1.27mm single row Through hole angled pin header THT 1x32 2.54mm single row Through hole angled pin header, 2x20, 2.54mm pitch, double rows Through hole pin header SMD 1x37 1.27mm single row Surface mounted pin header THT 2x37 1.00mm double row surface-mounted straight socket strip, 2x08, 1.27mm pitch, 3.9x4.9mm body, exposed pad, thermal vias, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with missing pin 6 8-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), Socket 14-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 14-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), body size 10.8x14.26mm 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils 16-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils 10-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 18-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 8x-dip-switch SPST Omron_A6S-810x, Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row.

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