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2x06, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted pin header THT 2x10 2.54mm double row surface-mounted straight socket strip, 2x32, 1.27mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x12 2.00mm single row Surface mounted pin header SMD 1x02 1.00mm single row style1 pin1 left Surface mounted pin header SMD 1x27 2.54mm single row style2 pin1 right Through hole straight pin header, 1x27, 2.00mm pitch, double rows Through hole straight Samtec HPM power header series 3.81mm post length THT 1x16 1.00mm single row style2 pin1 right Through hole IDC header, 2x17, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, 12.0mm latches, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole horizontal IDC box header THT 2x38 1.27mm double row Through hole angled pin header SMD 2x40 1.27mm double row Through hole IDC header, 2x20, 2.00mm pitch, single row (https://gct.co/files/drawings/bc065.pdf), script generated Through hole straight pin header, 2x40, 1.27mm pitch, 3.9x4.9mm body, exposed pad, 7x7mm body (http://www.analog.com/media/en/technical-documentation/data-sheets/AD7951.pdf, http://www.analog.com/en/design-center/packaging-quality-symbols-footprints/symbols-and-footprints/AD7951.html LFCSP-WD, 8 Pin (https://www.nxp.com/docs/en/data-sheet/TJA1051.pdf#page=16), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-20DP-0.5V, 20 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Harting har-flexicon vertical Harting har-flexicon series connector, 53261-1171 (http://www.molex.com/pdm_docs/sd/532610271_sd.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B9P-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py HTSSOP, 44 Pin (http://www.ti.com/lit/ds/symlink/tpa3251.pdf#page=38), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-52XX, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator JST SH series connector, B12B-ZESK-D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py LQFN, 12 Pin (https://www.nxp.com/docs/en/data-sheet/MMZ09332B.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 32 Pin (https://www.nxp.com/docs/en/data-sheet/LPC111X.pdf#page=108), generated with kicad-footprint-generator JST XA series connector, S13B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-2103, With thermal vias 10-Lead Plastic Dual Flat, No Lead Package (MC) - 2x3x0.9 mm Body [QFN]; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152ze.pdf WLCSP-143, 11x13 raster, 4.539x5.849mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f303r8.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.65mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32l152zc.pdf UFBGA 132 Pins, 0.5mm Pitch, https://www.adestotech.com/wp-content/uploads/AT25SL321_112.pdf#page=75 WLCSP 12 1.56x1.56 https://ae-bst.resource.bosch.com/media/_tech/media/datasheets/BST-BMM150-DS001-01.pdf WLCSP-12, 6x4 raster staggered array, 1.403x1.555mm package, pitch 0.35mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l151cc.pdf WLCSP-64, 8x8 raster, 5x5mm package, pitch 0.4mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f103ze.pdf Lattice caBGA-381 footprint for the male part, as it is based on https://www.schmitzbits.de/ms20.html which is an owner of Copyright (c) 2016 Andrey Nering Permission is hereby granted, free of charge, to any person obtaining a copy Copyright (c) 2013 Google. All rights reserved. Redistribution and use in describing the origin of the following: a. Any file in.

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