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Http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.553x2.579mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZR0009 Texas Instruments, DSBGA, 3.0x1.9x0.625mm, 28 ball 7x4 area grid, NSMD pad definition (http://www.ti.com/lit/ds/slas718g/slas718g.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, single row style2 pin1 right Through hole angled socket strip, 1x27, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole vertical IDC box header THT 2x19 2.00mm double row surface-mounted straight pin header, 1x24, 2.00mm pitch, double rows Surface mounted pin header THT 1x25 2.54mm single row Surface mounted pin header SMD 1x26 1.00mm single row style1 pin1 left Surface mounted socket strip SMD 2x05 2.00mm double row Through hole straight pin header, 2x17, 2.00mm pitch.

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