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I 28 pins TSOP-I, 32 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation DA), generated with kicad-footprint-generator Mounting Hardware, inside through hole 3.3mm, height 2.5, Wuerth electronics 9775031960 (https://katalog.we-online.com/em/datasheet/9775031960.pdf), generated with kicad-footprint-generator Molex Micro-Fit 3.0 Connector System, 43045-0800 (alternative finishes: 43045-180x), 9 Pins (http://www.molex.com/pdm_docs/sd/559350530_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2.5 mm² wires, reinforced insulation, conductor diameter 0.9mm, outer diameter 3.5mm, size 7.7x7mm^2, drill diamater 1.3mm, pad diameter 3mm, see .

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