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6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf ST WLCSP-100, ST die ID 480, 4.57x4.37mm, 132 Ball, 12x11 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 3x3 (perimeter) array, NSMD.

• -0.367735 0.111552 0.923216 vertex 0.111422 8.98903.
• -0.124395 0.48503 0.865605 facet normal 0.598712 0.491347.
• 4c5e03f875a81278be4b8089dd10dd98b0c86e5d Add scad for v3.2 Add scad.

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