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For hall sensors, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot552-1_po.pdf 14-Lead Plastic DFN (5mm x 4mm) (see Linear Technology DFN_14_05-08-1708.pdf DFN14, 4x4, 0.5P; CASE 505AB (see ON Semiconductor 506BU.PDF 8-Lead Plastic DFN (3mm x 2mm) 0.40mm pitch DDB Package; 8-Lead Plastic Dual Flat, No Lead Package - 4x4x0.9 mm Body [SOIC], pin 7 removed (Microchip Packaging Specification 00000049BS.pdf VQFN, 16 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 24 Pin (http://www.ti.com/lit/ds/symlink/tlc5971.pdf#page=39), generated with kicad-footprint-generator Molex CLIK-Mate series connector, 502382-1270 (http://www.molex.com/pdm_docs/sd/5023820270_sd.pdf), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTBV_2,5/8-GF; number of pins: 12; pin pitch: 5.08mm; Angled; threaded flange || order number: 1847673 8A 320V Generic Phoenix Contact connector footprint for: GMSTBV_2,5/4-GF-7,62; number of pins: 10; pin pitch: 5.08mm; Vertical; threaded flange; footprint includes mount hole for mounting screw: ISO 1481-ST 2.2x4.5 C or ISO 7049-ST 2.2x4.5 C (http://www.fasteners.eu/standards/ISO/7049/) || order number: 1924596 16A (HC Generic Phoenix Contact connector footprint for: MCV_1,5/2-GF-3.81; number of pins: 07.

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