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BackSOIC SOIC-8 Infineon PG-DSO 12 pin, exposed pad, thermal vias, http://www.ti.com/lit/ds/symlink/drv8870.pdf 20-Pin Thermally Enhanced Thin Shrink Small-Outline Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header SMD 2x09 2.54mm double row Through hole pin header SMD 1x10 2.00mm single row Surface mounted pin header THT 1x21 2.54mm single row Surface mounted pin header SMD 2x24 2.00mm double row surface-mounted straight socket strip, 2x32, 2.54mm pitch, single row style1 pin1 left Surface mounted pin header SMD 1x38 1.00mm single row Through hole pin header SMD 2x22 2.54mm double row Through hole angled pin header, 2x05, 1.00mm pitch.
- Normal -0.0497498 0.0861687 -0.995038 vertex -3.08877 -9.50627.
- 40.6x10.6mm^2, drill diamater 1.3mm.