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Https://toshiba.semicon-storage.com/info/docget.jsp?did=53548&prodName=TLP2770 6-Lead Plastic Dual Flat No-Lead Package, 3x3mm Body (see Microchip Packaging Specification 00000049BS.pdf 20-Lead Plastic Quad Flat, No Lead Package - 9x9 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), SMDSocket, LongPads THT DIP DIL PDIP SMDIP 2.54mm 9.53mm 375mil Clearance8mm 4-lead surface-mounted (SMD) DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/chs.pdf), SMD SMD 2x-dip-switch SPST Omron_A6S-210x, Slide, row spacing 7.62 mm (300 mils 32-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, SmallPads 6-lead though-hole mounted DIP package, row spacing 8.9 mm (350 mils), SMDSocket, SmallPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/lnk520.pdf Power Integrations eDIP-12B, see https://www.power.com/sites/default/files/product-docs/linkswitch-pl_family_datasheet.pdf 4-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 4x-dip-switch SPST Omron_A6S-410x, Slide, row spacing 9.53 mm (375 mils), Clearance8mm 18-lead surface-mounted (SMD) DIP package, row spacing 11.48 mm (451 mils 20-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), body size 6.7x26.96mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Piano, row spacing 7.62 mm (300 mils), body size 6.7x24.42mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf DIP Switch SPST Slide 5.9mm 232mil SMD 1x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads THT DIP DIL PDIP 2.54mm 25.4mm 1000mil LongPads 40-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils 40-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils), Socket 32-lead though-hole mounted DIP package, row spacing 25.4 mm (1000 mils THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier, https://www.comchiptech.com/admin/files/product/SC35VB80S-G%20Thru506369.%20SC35VB160S-G%20RevB.pdf 4-lead dip package for Vishay CNY70 refective photo coupler/interrupter Vishay CNY70 refective photo coupler package for Omron G6H-2F.

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