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HX06-P hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/htfs_200_800-p.pdf LEM HX02-P hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%202_6-p_e%20v5.pdf LEM HX03-P-SP2 hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%205_15-np_e%20v10.pdf LEM HX05-P-SP2 hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%203_50-p_sp2_e%20v07.pdf LEM HX25-P-SP2 hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/hx%202_6-p_e%20v5.pdf LEM HX05-NP hall effect current transducer (https://www.lem.com/sites/default/files/products_datasheets/htfs_200_800-p.pdf LEM HX02-P hall effect current transducer LEM_LTSR-NP 5V supply voltage series https://www.lem.com/sites/default/files/products_datasheets/ltsr_6-np.pdf DFN, 4 Pin (https://ww1.microchip.com/downloads/en/DeviceDoc/DSC60XX-Ultra-Small-Ultra-Low-Power-MEMS-Oscillator-DS20005625C.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 40 Pin (https://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/lfcspcp/cp-40/CP_40_15.pdf), generated with kicad-footprint-generator Molex Mini-Fit Jr. Power Connectors, 42819-32XX, With thermal vias in pads, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex CLIK-Mate series connector, LY20-18P-DLT1, 9 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator connector JST LEA top entry Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 502430-5010, 50 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 20-Pin Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body [SSOP] (see Microchip Packaging Specification 00000049BS.pdf SSOP, 32 Pin (http://www.ti.com/lit/ds/symlink/msp430f1122.pdf#page=54), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-2791, 27 Circuits (https://www.molex.com/pdm_docs/sd/2005280270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py UQFN, 28 Pin (http://www.ti.com/lit/ds/symlink/lm5175.pdf#page=40), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1.5mm, size source Multi-Contact FLEXI-E/HK 0.127 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, 2.05 inner diameter ), https://gct.co/files/drawings/dcj200-10.pdf DC Power Jack, 13A, 24V, Panel Mount,Through-hole, https://www.switchcraft.com/Drawings/RAPC10U_CD.pdf barreljack switchcraftconxall dc power Wuerth electronics 9774040943 (https://katalog.we-online.de/em/datasheet/9774040943.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 24 Pin (JEDEC MO-153 Var JA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Harwin Male Horizontal Surface Mount Tactile Switch SPST Slide 5.25mm 206mil JPin SMD 5x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 5x-dip-switch SPST Omron_A6S-510x, Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 11.48 mm (451 mils 24-lead surface-mounted (SMD) DIP package, row spacing 15.24 mm (600 mils), SMDSocket, SmallPads 20-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 48-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 12-lead.

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