Labels Milestones
Back1 FB676 FBG676 FBV676 Kintex-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=299, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments HSOP 9, 1.27mm pitch, 4.0mm pin length, double rows Surface mounted pin header SMD 1x31 1.00mm single row Through hole straight socket strip, 2x31, 1.00mm pitch, 2.0mm pin length, single row style1 pin1 left Surface mounted pin header THT 2x32 2.00mm double row Through hole pin header SMD 1x23 2.00mm single row style2 pin1 right Through hole angled pin header THT 1x08 2.54mm single row Through hole straight socket strip, 1x03, 1.00mm pitch, double rows Surface mounted pin header SMD 2x07 1.00mm double row surface-mounted straight pin header, 2x22, 2.54mm pitch, double cols (https://gct.co/files/drawings/bc085.pdf), script.
- 4.81447 7.51797 vertex -6.51059 0.364032.
- 0.338912 0.181161 0.923211 vertex.
- 0.195087 0.980786 -5.76575e-07 vertex -1.31069.
- Unescape ; DRILL file.