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Https://assets.nexperia.com/documents/data-sheet/PCMFXUSB3S_SER.pdf ST WLCSP-18, ST Die ID 466, 1.86x2.14mm, 18 Ball, X-staggered 21x11 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb55vc.pdf Texas Instruments BGA-289, 0.4mm pad, 15x15mm, 289 Ball, 17x17 Layout, 0.8mm Pitch, https://www.micron.com/-/media/client/global/documents/products/data-sheet/dram/ddr3/4gb_ddr3l.pdf#page=25.

• B404e3f9c5cb79c1ce2c1b1d88da892bdd69efea Mon Sep 17 00:00:00 2001 Subject: [PATCH.
• Relay DPDR Pitch 5.08 AXICOM IM-Series.
• Pad 3.0x4.2mm, Texas Instruments DSBGA BGA YFF.

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