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22.00mm length 27mm width 11mm Capacitor C, Rect series, Radial, pin pitch=15.80mm, , length*width=41.9*19.1mm^2, Vishay, TJ7, http://www.vishay.com/docs/34079/tj.pdf L_Toroid Vertical series Radial pin pitch 10.00mm length 11.5mm width 5.2mm Capacitor C, Rect series, Radial, pin pitch=5.00mm, , diameter=13mm, Electrolytic Capacitor CP, Radial series, Radial, pin pitch=15.00mm, , diameter=21mm, Vishay, IHB-2, http://www.vishay.com/docs/34015/ihb.pdf Inductor Radial series Radial pin pitch 5.08mm size 35.6x11.2mm^2 drill 1.3mm pad 2.5mm terminal block connector http://www.phoenixcontact.com/us/products/1778719/pdf PhoenixContact PTSM0,5 6 HV 2,5mm vertical SMD spring clamp terminal block Metz Connect Type011_RT05505HBWC pitch 5mm Varistor, diameter 15.5mm, width 5.2mm, pitch 5mm Varistor, diameter 7mm, width 3.5mm, pitch 5mm size 60x10mm^2 drill 1.3mm pad 2.6mm terminal block Metz Connect Type059_RT06305HBWC, 5 pins, pitch 7.5mm, size 51.5x15mm^2, drill diamater 1.1mm, pad diameter 2.4mm, outer diameter 3.9mm, size source Multi-Contact FLEXI-xV 2.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py LFCSP, 16 Pin (https://www.haloelectronics.com/pdf/discrete-ultra-100baset.pdf), generated with kicad-footprint-generator Molex Pico-Clasp series connector, BM09B-SRSS-TB (http://www.jst-mfg.com/product/pdf/eng/eSH.pdf), generated with kicad-footprint-generator Hirose DF12C SMD, DF12C3.0-10DS-0.5V, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 28 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/8008S.pdf#page=16), generated with kicad-footprint-generator Molex PicoBlade Connector System, 43045-1600 (alternative finishes: 43045-102x), 5 Pins (https://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=826576&DocType=Customer+Drawing&DocLang=English), generated with kicad-footprint-generator JST XA series connector, S9B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Molex PicoBlade series connector, B4P-VH-B (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-133-02-xxx-DV-BE-LC, 33 Pins per row (http://www.molex.com/pdm_docs/sd/530480210_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 2 times 1.5 mm² wires, reinforced insulation, conductor diameter 1.25mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 0.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex LY 20 series connector, 78171-0005 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 6 times 1.5 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 0.15 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times 2.5 mm² wires, basic insulation, conductor diameter 0.9mm, outer diameter 1mm, size source Multi-Contact FLEXI-E 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Straight solder pin 1 x 1 mm, 734-180 , 20 Pins (http://www.molex.com/pdm_docs/sd/908140004_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 32-Leads, Body 5x5x0.8mm, Pitch 0.5mm, Thermal Pad 3.1x3.1mm; (see Texas Instruments DSBGA BGA YFF S-XBGA-N5 Texas Instruments, DSBGA, 1.36x1.86mm, 10 bump 3x4 (area) array, NSMD pad definition Appendix A BGA 484 0.8 SB484 SBG484 SBV484 Zynq-7000 BGA, 30x30 grid, 31x31mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition.

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