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Package (MC) - 2x3x0.9 mm Body [DFN-S] (see Microchip Packaging Specification 00000049BS.pdf 44-Lead Plastic Thin Quad Flatpack No-Lead Package, Body 4.4x6.5x1.1mm, Pad 3.0x4.2mm, Texas Instruments EUS 5 Pin Double Sided Module Texas Instruments DSBGA BGA YZP R-XBGA-N8 Texas Instruments, DSBGA, 0.822x1.116mm, 5 bump 2x1x2 array, NSMD.

• Page 133, script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_Phoenix THT Terminal Block.
• 0.0973393 -0.995186 0.0113559 vertex.
• 2016 Matthew Holt Permission.

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