synth_tools

Back

AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-194), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-108-02-xx-DV-TE, 8 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-BE-A, 23 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, old mpn/engineering number: 1-770874-x, 2 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Molex PicoBlade Connector System, 5267-09A, 9 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN), generated with kicad-footprint-generator ipc_gullwing_generator.py HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/tda7266d.pdf, www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0 x 15.9mm Pitch 0.65mm HSOP 11.0x15.9mm Pitch 0.65mm Slug Up (PowerSO-20) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 1.27mm Slug Down Thermal Vias (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP 11.0x15.9mm Pitch 0.65mm SSOP, 8 Pin (https://pdfserv.maximintegrated.com/package_dwgs/21-0168.PDF), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 64 Pin (https://www.silabs.com/documents/public/data-sheets/cp2108-datasheet.pdf), generated with kicad-footprint-generator JST PHD series connector, 505405-0270 (http://www.molex.com/pdm_docs/sd/5054050270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 10-Lead Plastic WSON, 2x2mm Body, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, 0.3mm Ball, http://www.st.com/resource/en/datasheet/stm32l486qg.pdf UFBGA-144, 12x12 raster, 10x10mm package, pitch 0.8mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f103tb.pdf LFBGA-144, 12x12 raster, 7x7mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32l052t8.pdf WLCSP-36, 6x6 raster, 2.605x2.703mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32mp151a.pdf ST UFBGA-73, 5.0x5.0mm, 73 Ball, 9x9 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/ts3a24159.pdf Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition Appendix A BGA 676 1 FF676 FFG676 FFV676 Kintex-7 and Zynq-7000 BGA, 34x34 grid, 35x35mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small Outline (ST)-4.4 mm Body [QFN]; (see Microchip Packaging Specification 00000049BS.pdf 80-Lead Plastic Thin Quad Flatpack (PF) - 14x14x1 mm Body, 2.00 mm Footprint [TQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506AF.PDF DKD Package; 24-Lead Plastic QFN (4mm x 3mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CN (see ON Semiconductor 506AF.PDF DKD Package; 32-Lead Plastic Thin Shrink Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC Pitch 2.54 SSO Stretched SO SOIC Pitch 1.27 SSOP-8 2.9 x2.8mm Pitch 0.65mm Slug Up (PowerSO-36) [JEDEC MO-166] (http://www.st.com/resource/en/datasheet/vn808cm-32-e.pdf, http://www.st.com/resource/en/application_note/cd00003801.pdf HSOP, 54 Pin (https://www.nxp.com/docs/en/package-information/98ASA10506D.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-R (7260-38 Metric), IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger.

New Pull Request

Labels Milestones