Labels Milestones
BackPitch, http://www.issi.com/WW/pdf/43-46LQ32256A-AL.pdf Altera BGA-256 M256 MBGA BGA-256, dimensions: https://www.xilinx.com/support/documentation/package_specs/ft256.pdf, design rules: https://www.xilinx.com/support/documentation/user_guides/ug1099-bga-device-design-rules.pdf Altera UBGA U324 BGA-324 BGA-624, 25x25 grid, 21x21mm package, pitch 0.35mm; https://datasheets.maximintegrated.com/en/ds/MAX40200.pdf WLP-9, 1.448x1.468mm, 9 Ball, 3x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 3.277x3.109mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.5mm; see section 7.2 of http://www.st.com/resource/en/datasheet/stm32f207vg.pdf WLCSP-66, 8x9 raster, 3.767x4.229mm package, pitch 0.8mm; see section 48.2.4 of http://ww1.microchip.com/downloads/en/DeviceDoc/DS60001479B.pdf WLCSP-81, 9x9, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32wb15cc.pdf#page=119 ST WLCSP-52, ST die ID 467, 3.09x3.15mm, 52 Ball, X-staggered 18x10 Layout, 0.4mm Pitch, http://www.st.com/content/ccc/resource/technical/document/technical_note/92/30/3c/a1/4c/bb/43/6f/DM00103228.pdf/files/DM00103228.pdf/jcr:content/translations/en.DM00103228.pdf pSemi CSP-16 1.64x2.04x0.285mm (http://www.psemi.com/pdf/datasheets/pe29101ds.pdf, http://www.psemi.com/pdf/app_notes/an77.pdf UFD Package, 4-Lead Plastic Small outline http://www.ti.com/lit/ml/mpds158c/mpds158c.pdf VSO40: plastic very small outline package; 56 leads; body width 4.4 mm; (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot556-1_po.pdf 24-Lead Plastic Shrink Small Outline (ST)-4.4 mm Body [SOIC] (http://ww1.microchip.com/downloads/en/PackagingSpec/00000049BQ.pdf SOIC, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/20005045C.pdf#page=23), generated with kicad-footprint-generator Hirose DF12E SMD, DF12E3.0-20DP-0.5V, 20 Pins (http://www.molex.com/pdm_docs/sd/555600207_sd.pdf), generated with kicad-footprint-generator Hirose series connector, S28B-PHDSS (http://www.jst-mfg.com/product/pdf/eng/ePHD.pdf), generated with kicad-footprint-generator JST SUR series connector, 502386-1170 (http://www.molex.com/pdm_docs/sd/5023860270_sd.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py VQFN, 16 Pin (https://www.st.com/resource/en/datasheet/stp08cp05.pdf#page=20), generated with kicad-footprint-generator Molex KK-254 Interconnect System, old/engineering part number: A-41791-0006 example for new mpn: 39-28-912x, 6 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 44 Pin (http://www.issi.com/WW/pdf/61-64C5128AL.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-121-02-xxx-DV-BE, 21 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Harting har-flexicon series connector, B2P3-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Inductor SMD 1206 (3216 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: IPC-SM-782 page 76, https://www.pcb-3d.com/wordpress/wp-content/uploads/ipc-sm-782a_amendment_1_and_2.pdf, https://docs.google.com/spreadsheets/d/1BsfQQcO9C6DZCsRaXUlFlo91Tg2WpOkGARC1WS5S8t0/edit?usp=sharing), generated with kicad-footprint-generator Mounting Hardware, inside blind hole M1.6, height 4, Wuerth electronics 9774060482 (https://katalog.we-online.de/em/datasheet/9774060482.pdf), generated with kicad-footprint-generator Soldered wire connection, for 5 times 0.1 mm² wires, reinforced insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-xV 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Connector Phoenix Contact, SPT 2.5/2-H-5.0-EX Terminal Block, 1732548 (https://www.phoenixcontact.com/online/portal/gb/?uri=pxc-oc-itemdetail:pid=1732548), generated with kicad-footprint-generator JST PH series connector, 202396-0907 (http://www.molex.com/pdm_docs/sd/2023960207_sd.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1430, 14 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Hirose DF11 through hole, DF11-18DP-2DSA, 9 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: 26-60-5150, 15 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039289068_sd.pdf), generated with kicad-footprint-generator Capacitor.
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