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Header, 1x26, 1.00mm pitch, double rows Through hole angled pin header THT 2x33 2.00mm double row Through hole socket strip THT 2x40 1.27mm double row Through hole straight pin header, see http://www.formfactors.org/developer%5Cspecs%5Crev1_2_public.pdf pin header THT 1x31 1.27mm single row Surface mounted pin header SMD 1x02 2.54mm single row style1 pin1 left Surface mounted socket strip SMD 1x31 1.27mm single row style1 pin1 left Surface mounted pin header SMD 1x24 1.27mm single row Through hole pin header THT 2x06 2.54mm double row surface-mounted straight pin header, 2x31, 1.27mm pitch, double cols (from Kicad 4.0.7), script generated Through hole Samtec HPM power header series 3.81mm post length THT 1x02 2.54mm single row style2 pin1 right Through hole socket strip THT 1x19 1.00mm single row Through hole angled socket strip THT 1x38 2.00mm single row Through hole angled pin header, 1x35, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header, 2x35, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7), script generated Through hole pin header THT 2x01 2.00mm double row Through hole Samtec HPM power header series 11.94mm post length THT 1x05 2.00mm single row Surface mounted pin header SMD 1x16 2.54mm single row Through hole angled pin header, 1x07, 1.27mm pitch, 3.9x4.9mm body, exposed pad, DDA0008J (http://www.ti.com/lit/ds/symlink/tps5430.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm² body, exposed pad, thermal vias in pads, 3 Pins (http://www.molex.com/pdm_docs/sd/559350210_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-138-02-xxx-DV-BE-A, 38 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py DDB Package; 10-Lead Plastic WSON, 4x3mm Body, 0.5mm Pitch, https://www.ti.com/lit/ds/symlink/sn74lvc1g17.pdf#page=42, https://www.ti.com/lit/ml/mxbg018l/mxbg018l.pdf BGA 5 0.5 YZP Texas Instruments, DSBGA, area grid, NSMD, YZP0005 pad definition, 0.8875x1.3875mm, 5 Ball, 2x3 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32g051f8.pdf#page=102 ST WLCSP-25, ST die ID 464, 2.58x3.07mm, 36 Ball, 6x6 Layout, 0.4mm Pitch, https://www.ti.com/lit/gpn/ina234 Texas Instruments, DSBGA-6, 0.704x1.054mm.

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