Labels Milestones
BackRaster, 4.095x5.094mm package, pitch 0.4mm; see section 36.2.3 of http://ww1.microchip.com/downloads/en/DeviceDoc/Atmel-42363-SAM-D11_Datasheet.pdf WLCSP-56, 7x8 raster, 3.170x3.444mm package, pitch 0.4mm; see section 6.6 of http://www.st.com/resource/en/datasheet/DM00273119.pdf X1-WLB0909, 0.89x0.89mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, YBG pad definition, 0.95x1.488mm, 6 Ball, 2x3 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A Artix-7 BGA, 22x22 grid, 23x23mm package, 1mm pitch.
- RND 205-00067, 2 pins.
- 4x4mm, https://www.we-online.com/catalog/en/WE-LQSH#/articles/WE-LQSH-4020 Current-compensated Chokes, Schaffner.