3
1
Back

5.3 mm Body [SOIC], pin 7 8-lead though-hole mounted DIP package, row spacing 11.43 mm (450 mils), SMDSocket, SmallPads 10-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), SMDSocket, SmallPads 18-lead though-hole mounted DIP package.

New Pull Request