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BGA (based on standard DIP-4), row spacing 8.61 mm (338 mils), body size 9.78x22.5mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile SMD DIP Switch SPST Slide 6.15mm 242mil SMD 2x-dip-switch SPST CTS_Series194-2MSTN, Piano, row spacing 11.48 mm (451 mils 32-lead surface-mounted (SMD) DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads THT DIP DIL PDIP 2.54mm 7.62mm 300mil Three phase, Bridge, Rectifier 4-lead round diode bridge package, diameter 8.9mm, pin pitch 10.00mm length 11.5mm width 11.5mm Neosid NE-CPB-11EN Drill1.5mm Inductor.

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