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Filmoscope Quentin/COLOR SPRAY.png create mode 100644 Hardware/PCB/precadsr_Gerbers/precadsr-job.gbrjob create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/analogoutput_12mm.kicad_mod create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/Potentiometer_Bourns_3296W_Vertical_screw_centered.kicad_mod delete mode 100644 Hardware/Panel/precadsr-panel-Gerbers/precadsr-panel.gbrjob create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Panel_Slotted_Mounting_Hole.kicad_mod delete mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/SolderWirePad_1x01_Drill0.8mm.kicad_mod delete mode 100644 Schematics/SynthMages.pretty/SOCKET_2_PIN_Header.kicad_mod create mode 100644 Hardware/PCB/precadsr/Kosmo_panel.pretty/fastestenv_Jack_Hole.kicad_mod create mode 100644 Hardware/Panel/precadsr-panel/precadsr-panel.pro create mode 100644 Hardware/PCB/precadsr/ao_tht.pretty/C_Disc_D3.0mm_W1.6mm_P2.50mm.kicad_mod create mode 100644 Hardware/Panel/precadsr-panel/precadsr-panel-cache.lib delete mode 100644 Hardware/Panel/precadsr_panel_al_Gerbers/precadsr_panel_al-Edge_Cuts.gbr create mode 100644 3D Printing/AD&D 1e spell names in Filmoscope Quentin/Panels/UNSEEN SERVANT.png differ Latest commits for file Images/capsocket.png b554ec2138 Add footprint items for panel holes; separate panel and pcb into different files Add footprint items for panel holes; separate panel and pcb into different files Altech AK300 serie connector Dinkle DT-55-B01X Terminal Block Phoenix PTSM-0,5-2-2.5-V-THR vertical pitch 2.5mm size 19.7x10mm^2 drill 1.2mm pad 2.4mm Terminal Block 4Ucon ItemNo. 10706 vertical pitch 3.5mm size 36x8.3mm^2 drill 1.3mm pad 2.6mm Terminal Block 4Ucon ItemNo. 10701, vertical (cable from top), 4 pins, pitch 5mm, size 20x10.5mm^2, drill diamater 1.3mm, pad diameter 2.5mm, see http://cdn-reichelt.de/documents/datenblatt/C151/RND_205-00276_DB_EN.pdf, script-generated with , script-generated using https://github.com/pointhi/kicad-footprint-generator/scripts/TerminalBlock_4Ucon THT Terminal Block Phoenix PT-1,5-10-3.5-H, 10 pins, dual row (http://ww1.microchip.com/downloads/en/DeviceDoc/64L_VQFN_7x7_Dual_Row_%5BSVB%5D_C04-21420a.pdf 40-Lead (32-Lead Populated) Plastic Quad Flat, No Lead Package (UC) - 3x3x0.5 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (4mm x 3mm) (http://pdfserv.maximintegrated.com/land_patterns/90-0063.PDF 14-lead very thin plastic quad flat, 3.0x4.5mm size, 0.65mm pitch (http://www.akm.com/akm/en/file/datasheet/CQ-330J.pdf AKM CZ-381x current sensor, 5.6x7.9mm body, 0.65mm pitch (http://ww1.microchip.com/downloads/en/DeviceDoc/14L_VDFN_4_5x3_0mm_JHA_C041198A.pdf DE Package; 14-Lead Plastic DFN (5mm x 3mm) (see Linear Technology DFN_12_05-08-1695.pdf DF Package; 12-Lead Plastic Micro Small Outline (SO), see https://docs.broadcom.com/cs/Satellite?blobcol=urldata&blobheader=application%2Fpdf&blobheadername1=Content-Disposition&blobheadername2=Content-Type&blobheadername3=MDT-Type&blobheadervalue1=attachment%3Bfilename%3DIPD-Selection-Guide_AV00-0254EN_030617.pdf&blobheadervalue2=application%2Fx-download&blobheadervalue3=abinary%253B%2Bcharset%253DUTF-8&blobkey=id&blobnocache=true&blobtable=MungoBlobs&blobwhere=1430884105675&ssbinary=true SSO Stretched SO SOIC 2.54 8-Lead Plastic Dual Flat, No Lead Package, 1.2x1.8x1.55 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations K Package PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Dual (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72600/72600.pdf PowerPAK SO-8 Single (https://www.vishay.com/docs/71655/powerpak.pdf, https://www.vishay.com/docs/72599/72599.pdf 16-Lead Plastic DFN (3mm x 3mm); Pitch 0.4mm; EP 1.7x1.54mm; for InvenSense motion sensors; Mask removed below exposed pad; keepout area marked (Package see: https://store.invensense.com/datasheets/invensense/MPU9250REV1.0.pdf; See also https://www.invensense.com/wp-content/uploads/2015/02/InvenSense-MEMS-Handling.pdf.

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