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HLE-129-02-xxx-DV-BE, 29 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOIC, 28 Pin (JEDEC MO-153 Var AA https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-145-02-xxx-DV-BE-LC, 45 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSOP I, 32 pins, 18.4x8mm body (https://www.micron.com/~/media/documents/products/technical-note/nor-flash/tn1225_land_pad_design.pdf TSOP-I, 56 Pin (https://www.espressif.com/sites/default/files/documentation/esp32-s2_datasheet_en.pdf#page=41), generated with kicad-footprint-generator Molex Nano-Fit Power Connectors, 105309-xx03, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST XH series connector, B04P-NV (http://www.jst-mfg.com/product/pdf/eng/eNV.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 64 Pin (https://datasheet.lcsc.com/szlcsc/Realtek-Semicon-RTL8211EG-VB-CG_C69264.pdf#page=77), generated with kicad-footprint-generator ipc_noLead_generator.py MLPQ 32 leads, 7x7mm, 0.127mm stencil (https://www.infineon.com/dgdl/ir4302.pdf?fileId=5546d462533600a4015355d602a9181d, https://www.infineon.com/dgdl/Infineon-AN1170-AN-v05_00-EN.pdf?fileId=5546d462533600a40153559ac3e51134 14-Lead Plastic Dual Flat, No Lead Package (MF) - 3x3x0.9 mm Body [QFN] with corner pads; see figure 8.2 of https://www.silabs.com/documents/public/data-sheets/efm8bb1-datasheet.pdf 20-Lead Plastic Thin Quad Flatpack (PT) - 7x7x1.0 mm Body, 2.00 mm Footprint [HTQFP] thermal pad TQFP64 7x7, 0.4P CASE 932BH (see ON Semiconductor 506CE.PDF DD Package; 8-Lead Plastic PSOP, Exposed Die Pad (TI DDA0008B, see http://www.ti.com/lit/ds/symlink/lm3404.pdf 8-pin HTSOP package with 1.27mm pin pitch, compatible with SOIC-8, 3.9x4.9mm body, exposed pad, thermal vias in pads, 2 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator ipc_noLead_generator.py TQFP, 48 Pin (http://www.ti.com/lit/ds/symlink/msp430f5232.pdf#page=111), generated with kicad-footprint-generator JST SUR series connector, LY20-24P-DT1, 12 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-145-02-xx-DV-TE, 45 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py SOP, 8 Pin (https://www.ti.com/lit/pdf/qfnd619), generated with kicad-footprint-generator connector JST J2100 series connector, B9PS-VH (http://www.jst-mfg.com/product/pdf/eng/eVH.pdf), generated with kicad-footprint-generator Hirose series connector, S11B-EH (http://www.jst-mfg.com/product/pdf/eng/eEH.pdf), generated with kicad-footprint-generator Soldered wire connection with feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0070, 7 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated.

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