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NSMD pad definition Appendix A BGA 676 1 RF676 RFG676 Artix-7 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=289, NSMD pad definition Appendix A Virtex-7 BGA, 44x44 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=294, https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=90, NSMD pad definition (http://www.ti.com/lit/ds/symlink/lm4990.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 1.36x1.86mm, 12 bump 4x3 grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, DSBGA, area grid, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments DSBGA BGA YZP R-XBGA-N6 Texas Instruments, DSBGA, 0.9x1.4mm, 6 bump 2x3 (perimeter) array, NSMD pad definition (http://www.ti.com/lit/ds/symlink/opa330.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments, BGA Microstar Junior, 2x2.5mm, 12 bump 3x4 (area) array, NSMD pad definition, 0.704x1.054mm, 6 Ball, 2x3 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32g473pb.pdf ST UFBGA-129, 7.0x7.0mm, 129 Ball, 13x13 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.st.com/resource/en/datasheet/stm32wl54jc.pdf ST UFBGA-121, 6.0x6.0mm, 121 Ball, 11x11 Layout, 0.5mm Pitch, https://www.diodes.com/assets/Datasheets/AP22913.pdf WLCSP-4, 0.64x0.64mm, 4 Ball, 2x2 Layout, 0.5mm Pitch, S-PWSON-N10, DSC, http://www.ti.com/lit/ds/symlink/tps63060.pdf USON-10 2.5x1.0mm_ Pitch 0.5mm vertical Molex 0.50mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0120, 12 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ103130.pdf), generated with kicad-footprint-generator Hirose DF13C SMD, CL535-0406-3-51, 6 Pins (http://www.farnell.com/datasheets/2157639.pdf), generated with kicad-footprint-generator JST PH series connector, B02B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M3, height 9, Wuerth electronics 9774060982 (https://katalog.we-online.de/em/datasheet/9774060982.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 8 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/mic23050.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-114-02-xxx-DV-BE-LC, 14 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Analog LFCSP-UQ, 10 Pin (http://rohmfs.rohm.com/en/products/databook/datasheet/ic/power/switching_regulator/bd8314nuv-e.pdf (Page 20)), generated with kicad-footprint-generator Molex CLIK-Mate series connector, B13B-XH-A (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex 734 Male header (for PCBs); Angled solder pin 1 x 1 mm, 734-164 , 4 Pins per row, Mounting: (http://www.molex.com/pdm_docs/sd/039281043_sd.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-117-02-xxx-DV-BE-LC, 17 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-136-02-xx-DV-PE-LC, 36 Pins per row, Mounting: Snap-in Plastic Peg PCB Lock (http://www.molex.com/pdm_docs/sd/039300020_sd.pdf), generated with kicad-footprint-generator Mounting Hardware, inside through hole M2, height 1.5, Wuerth electronics 9775096360 (https://katalog.we-online.com/em/datasheet/9775096360.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TQFP120 14x14 / TQFP120 CASE 932AZ (see ON Semiconductor 506CM.PDF DFN, 14 Pin (https://www.onsemi.com/pub/Collateral/FUSB302B-D.PDF#page=32), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times 1 mm² wires, basic insulation, conductor diameter 2mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-1791, 17 Circuits (https://www.molex.com/pdm_docs/sd/2005280170_sd.pdf), generated with kicad-footprint-generator 2220 Tricolor PLCC-4 LED, https://docs.broadcom.com/docs/ASMB-KTF0-0A306-DS100.

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