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Mm (300 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.nidec-copal-electronics.com/e/catalog/switch/cvs.pdf SMD 3x-dip-switch SPST Copal_CVS-03xB, Slide, row spacing 9.53 mm (375 mils 12-lead surface-mounted (SMD) DIP package, row spacing 9.53 mm (375 mils 22-lead though-hole.

• 0.0761286 0.995139 vertex -5.31765 -5.31765.
• 0.768477 0.63066 0.108216 facet normal -0.29705.
• PG-HDSOP-10-1 (DDPAK), 20.96x6.5x2.3mm, slug.
• Pcb for v2 front panel components and.

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