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1sqmm strain-relief Soldered wire connection with feed through strain relief, for 6 times 0.25 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator JST SH series connector, BM03B-ZESS-TBT (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator Molex Sabre Power Connector, 43160-0103, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55932-1010, with PCB cutout, light-direction downwards, see http://www.kodenshi.co.jp/products/pdf/sensor/photointerrupter_ref/SG-105.pdf Laser Diode, TO-3.3mm, 3pin Laser Diode, TO-38-ICut, 3pin Laser Diode, TO-3.3mm, 3pin Laser Diode, TO-56, 3pin lightpipe triple tower right angle DPDT push button https://www.e-switch.com/system/asset/product_line/data_sheet/210/800U.pdf CuK miniature slide switch, OS series, SPDT, right angle, PTS645VL39-2 LFS C&K Button tactile switch Wurth Wuerth Ultraminiature Surface Mount Single Row 2.54mm (0.1 inch) Pitch PCB Connector, M20-89003xx, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py 6-Lead Plastic Small Outline (SSO/Stretched SO), see https://www.vishay.com/docs/83831/lh1533ab.pdf SSO Stretched SO SOIC 1.27 16 12 Wide 16-Lead Plastic DFN (2mm x 2mm), http://ams.com/eng/content/download/950231/2267959/483138 DD Package; 12-Lead Plastic DFN (4mm x 4mm) (see Linear Technology DFN_16_05-08-1709.pdf DHC Package; 16-Lead Plastic Small Outline (SO) (http://www.everlight.com/file/ProductFile/201407061745083848.pdf 5-Lead Plastic Small Outline (ST)-4.4 mm Body [WSON], http://www.ti.com/lit/ml/mpds421/mpds421.pdf WSON-16 3.3 x 1.35mm Pitch 0.4mm WLCSP WLCSP/XFBGA 8-pin package, staggered pins, http://www.adestotech.com/wp-content/uploads/DS-AT25DF041B_040.pdf WLCSP WLCSP-8 XFBGA XFBGA-8 CSP BGA Chip-Scale Glass-Top WLCSP-8, 2.284x1.551mm, 8 Ball, 2x4 Layout, 0.5mm Pitch, http://www.ti.com/lit/ds/symlink/txb0104.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf BGA 12 0.5 R-XBGA-N12 Texas Instruments, DSBGA, area grid, NSMD pad definition Appendix A Artix-7 BGA, 19x19 grid, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=267, NSMD pad definition Appendix A BGA 484 0.8 RS484 Artix-7 BGA, 22x22 grid, 19x19mm package, 0.8mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=268, NSMD pad definition Appendix A BGA 225 0.8 CLG225 Zynq-7000 BGA, 22x22 grid.

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