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9x9 Layout, 0.4mm Pitch, YFF0006, NSMD pad definition Appendix A BGA 1760 1 FH1761 FHG1761 Virtex-7 BGA, 42x42 grid, 45x45mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txb0102.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (http://www.ti.com/lit/ds/symlink/tps22993.pdf QFN, 24 Pin (https://www.jedec.org/standards-documents/docs/mo-142-d variation AC), generated with kicad-footprint-generator Connector Phoenix Contact connector footprint for: MSTBV_2,5/2-GF; number of pins: 12; pin pitch: 3.81mm; Angled || order number: 1836189 8A 320V Generic Phoenix Contact connector footprint for: MCV_1,5/3-GF-3.5; number of pins: 12; pin pitch: 3.50mm; Vertical || order number: 1923979 16A (HC.

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