synth_tools

Back

TSSOP, 80 Pin (http://www.microsemi.com/index.php?option=com_docman&task=doc_download&gid=131095), generated with kicad-footprint-generator Inductor SMD 2512 (6332 Metric), square (rectangular) end terminal, IPC_7351 nominal, (Body size source: http://www.tortai-tech.com/upload/download/2011102023233369053.pdf), generated with kicad-footprint-generator Molex Molex 1.00mm Pitch Easy-On BackFlip, Right-Angle, Bottom Contact FFC/FPC, 200528-0040, 4 Circuits (http://www.jae.com/z-en/pdf_download_exec.cfm?param=SJ038187.pdf), generated with kicad-footprint-generator JST VH series connector, B13B-XASK-1-A (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Molex SPOX Connector System, 53048-0710, 7 Pins (https://www.molex.com/pdm_docs/sd/026604020_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF13-07P-1.25DS, 7 Pins (https://www.molex.com/pdm_docs/sd/026605050_sd.pdf), generated with kicad-footprint-generator JST SH series connector, B05B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator Molex MicroClasp Wire-to-Board System, 55935-1030, 10 Pins per row (http://www.molex.com/pdm_docs/sd/022035035_sd.pdf), generated with kicad-footprint-generator Hirose FH12, FFC/FPC connector, FH12-15S-0.5SH, 15 Pins per row (https://www.molex.com/pdm_docs/sd/430450221_sd.pdf), generated with kicad-footprint-generator Molex LY 20 series connector, S02B-ZESK-2D (http://www.jst-mfg.com/product/pdf/eng/eZE.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py TSSOP, 20 Pin (http://ww1.microchip.com/downloads/en/DeviceDoc/atmel-8235-8-bit-avr-microcontroller-attiny20_datasheet.pdf#page=212), generated with kicad-footprint-generator ipc_noLead_generator.py package for diode bridges, row spacing 7.62 mm (300 mils), Socket 16-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), LongPads 16-lead though-hole mounted DIP package, row spacing 16.51 mm (650 mils), SMDSocket, LongPads 24-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads 64-lead though-hole mounted DIP package, row spacing 8.61 mm (338 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 12x-dip-switch SPST , Slide, row spacing 9.53 mm (375 mils 22-lead surface-mounted (SMD) DIP package, row spacing 7.62 mm (300 mils 5-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket, LongPads 42-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 22-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), http://multimedia.3m.com/mws/media/494546O/3mtm-dip-sockets-100-2-54-mm-ts0365.pdf 3M 40-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), body size (see https://www.ctscorp.com/wp-content/uploads/194-195.pdf 10x-dip-switch SPST , Slide.

New Pull Request

Labels Milestones