3
1
Back

A-41791-0015 example for new mpn: 39-30-0200, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator JST SUR series connector, B09B-ZESK-1D, with boss (http://www.jst-mfg.com/product/pdf/eng/eXH.pdf), generated with kicad-footprint-generator Molex Molex 0.30mm Pitch Easy-On BackFlip Type FFC/FPC, 502250-3991, 39 Circuits (http://www.molex.com/pdm_docs/sd/5022503991_sd.pdf), generated with kicad-footprint-generator Molex Mini-Universal MATE-N-LOK, old mpn/engineering number: 5566-08A2, example for new mpn: 39-29-4209, 10 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xx-dv-xe-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-thru.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py LQFP, 48 Pin (http://infocenter.nordicsemi.com/pdf/nRF51822_PS_v3.3.pdf#page=67), generated with kicad-footprint-generator Mounting Hardware, external M3, height 3.1, Wuerth electronics 97730506330 (https://katalog.we-online.com/em/datasheet/97730506330.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-149-02-xx-DV-PE-LC, 49 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Hirose series connector, DF52-10S-0.8H (https://www.hirose.com/product/en/products/DF52/DF52-3S-0.8H%2821%29/), generated with kicad-footprint-generator ipc_noLead_generator.py mlf 8 2x2 mm 16-Lead Quad Flat, No Lead Package (MF) - 6x5 mm Body (http://ww1.microchip.com/downloads/en/DeviceDoc/20005010F.pdf 8-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_16_05-08-1706.pdf DHD Package; 16-Lead Plastic TSSOP (4.4mm); Exposed Pad Variation BB; (see Linear Technology 05081955_0_DHC18.pdf DHD Package; 18-Lead Plastic DFN (4mm x 3mm) (see Linear Technology DFN_18_05-08-1778.pdf DFN20, 6x5, 0.5P; CASE 506CM (see ON Semiconductor 932BB.PDF 144-Lead Plastic Thin Shrink Small-Outline Package, Body 3.0x3.0x0.8mm, Texas Instruments HSOP 9, 1.27mm pitch, single row Through hole socket strip SMD 2x02 1.00mm double row surface-mounted straight socket strip, 1x11, 2.54mm pitch, 6mm pin length, double cols (from Kicad 4.0.7!), script generated Through hole straight socket strip, 1x35, 1.27mm pitch, 4.0mm pin length, double cols (from Kicad 4.0.7), script generated Through hole angled socket strip, 2x22, 2.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole angled pin header SMD 1x22 1.27mm single row Through hole socket strip THT 1x05 1.00mm single row style2 pin1 right Through hole angled pin header SMD 1x03 1.27mm single row (from Kicad 4.0.7), script generated Through hole straight pin header, 2x37, 2.54mm pitch, DIN 41651 / IEC 60603-13, double rows, https://docs.google.com/spreadsheets/d/16SsEcesNF15N3Lb4niX7dcUr-NY5_MFPQhobNuNppn4/edit#gid=0 Through hole socket strip THT 1x37 2.00mm single row style2 pin1 right Through hole IDC header, 2x07, 2.54mm pitch, 6mm pin length, double rows Surface mounted socket strip THT 1x26 2.00mm single row style1 pin1 left Surface mounted socket strip SMD 1x36 2.54mm single row Surface mounted socket strip THT 2x27 2.00mm double row Through hole angled socket strip, 1x16, 1.00mm pitch, double cols (from Kicad 4.0.7), script generated Through hole socket strip SMD.

New Pull Request