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35 Ball, 7x5 Layout, 0.4mm Pitch, https://www.st.com/resource/en/datasheet/stm32l4p5ve.pdf ST WLCSP-115, ST die ID 461, 4.63x4.15mm, 115 Ball, Y-staggered 11x21 Layout, 0.35mm Pitch, https://www.ti.com/lit/ml/mxbg383/mxbg383.pdf, https://www.ti.com/lit/ds/symlink/tps62800.pdf Texas Instruments, DSBGA, 1.43x1.41mm, 8 bump 2x4 (perimeter) array, NSMD pad definition Appendix A BGA 1760 1.

• -1.752289e-01 vertex -1.093788e+02 9.725134e+01.
• Normal -8.416038e-01 -3.471391e-03 -5.400843e-01.
• Http://www.st.com/resource/en/datasheet/stm32f301r8.pdf WLCSP-49, 7x7 raster.

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