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# KiCad backups folders *-backups # Compressed files *.zip # Mac stuff *.DS_Store # Emacs temps *~ \#* # LTSpice Simulations/*.log Simulations/*.raw Simulations/*.txt Copper Layer Stackup: T5 15.200mm 0.5984" (1 hole T3 7.000mm 0.2756" (6 holes T4 10.000mm 0.3937" (4 holes) T5 15.200mm 0.5984" (1 hole Total plated holes unplated through holes: unplated through holes: merged pull request 'new_footprints' (#5) from new_footprints into main Reviewed-on: https://gitea.circuitlocution.com/synth_mages/MK_VCO/pulls/2 From 972d8b1e0797912e848110b19e1af10ed411bbbb Mon Sep 17 00:00:00 2001 Subject: [PATCH] updates to rev 2 beta by adding +5V, and both trigger/gate and CV on the https://www.onsemi.com/pub/Collateral/NCP115-D.PDF Panasonic HQFN-16, 4x4x0.85mm (https://industrial.panasonic.com/content/data/SC/ds/ds7/c0/PKG_HQFN016-A-0404XZL_EN.pdf Panasonic HSON-8, 8x8x1.25mm (https://industrial.panasonic.com/content/data/SC/ds/ds7/c0/PKG_HSON008-A-0808XXI_EN.pdf QFN, 12 Pin (http://www.analog.com/media/en/package-pcb-resources/package/pkg_pdf/ltc-legacy-qfn/QFN_12_%2005-08-1855.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 2.5 mm² wires, basic insulation, conductor diameter 1.25mm, outer diameter 1mm, size source Multi-Contact FLEXI-2V 0.25 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex SlimStack Fine-Pitch SMT Board-to-Board Connectors, 52991-0608, 60 Pins per row (https://cdn.harwin.com/pdfs/M20-781.pdf), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: AE-6410-07A example for new part number: A-41792-0013 example for new mpn: 39-30-0120, 6 Pins per row (http://www.te.com/commerce/DocumentDelivery/DDEController?Action=srchrtrv&DocNm=82181_SOFTSHELL_HIGH_DENSITY&DocType=CS&DocLang=EN.

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