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THT HC-52/8mm, http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/XS71xx.pdf Crystal THT HC-33/U http://pdi.bentech-taiwan.com/PDI/GEN20SPEV20HC3320U.pdf Crystal THT HC-51 http://www.crovencrystals.com/croven_pdf/HC-51_Crystal_Holder_Rev_00.pdf Crystal THT DS10 1.0mm diameter http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/DS-Series.pdf Crystal THT HC-51/6mm http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/XS71xx.pdf Crystal THT HC-51 http://www.crovencrystals.com/croven_pdf/HC-51_Crystal_Holder_Rev_00.pdf Crystal THT HC-52/6mm, http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/XS71xx.pdf Crystal THT HC-52/8mm, http://www.kvg-gmbh.de/assets/uploads/files/product_pdfs/XS71xx.pdf Crystal THT HC-18/U, http://5hertz.com/pdfs/04404_D.pdf Crystal THT DS15 5.0mm length 1.5mm diameter http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/DS-Series.pdf Crystal THT HC-51 http://www.crovencrystals.com/croven_pdf/HC-51_Crystal_Holder_Rev_00.pdf Crystal THT DS15 5.0mm length 1.5mm diameter http://www.microcrystal.com/images/_Product-Documentation/03_TF_metal_Packages/01_Datasheet/DS-Series.pdf SMD Crystal EuroQuartz MJ series http://cdn-reichelt.de/documents/datenblatt/B400/MJ.pdf, 5.0x3.2mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002CE https://support.epson.biz/td/api/doc_check.php?mode=dl&lang=en&Parts=SG-8002DC, 3.2x2.5mm^2 package SMD Crystal Oscillator Seiko Epson MC-156 https://support.epson.biz/td/api/doc_check.php?dl=brief_MC-156_en.pdf, hand-soldering, 7.1x2.5mm^2 package SMD Crystal Oscillator Seiko Epson MC-506 http://media.digikey.com/pdf/Data%20Sheets/Epson%20PDFs/MA-505,506.pdf, 12.7x5.1mm^2 package SMD Crystal Oscillator Seiko Epson SG-8002LB https://support.epson.biz/td/api/doc_check.php?mode=dl⟨=en&Parts=SG-8002DC, 5.0x3.2mm^2 package 14-lead dip package, row spacing 6.73 mm (264 mils), body size (see http://omronfs.omron.com/en_US/ecb/products/pdf/en-a6s.pdf SMD 11x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), Socket, LongPads 32-lead though-hole mounted DIP package, row spacing 7.62 mm (300 mils), LongPads, see https://ac-dc.power.com/sites/default/files/product-docs/tinyswitch-iii_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab, https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations E Package eSIP-7F Flat Package with Heatsink Tab https://ac-dc.power.com/sites/default/files/product-docs/linkswitch-ph_family_datasheet.pdf SIP4 Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf Footprint for Mini-Circuits case CD542 (https://ww2.minicircuits.com/case_style/CD542.pdf) using land-pattern PL-052, including GND-vias (https://www.minicircuits.com/pcb/98-pl247.pdf Footprint for Mini-Circuits case YY161 (https://ww2.minicircuits.com/case_style/YY161.pdf Footprint for Mini-Circuits case GP731.

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