Labels Milestones
BackEUS 5 Pin Double Sided Module 16-pin module, column spacing 22.86 mm (900 mils), Socket 48-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils), Socket THT DIP DIL PDIP 2.54mm 22.86mm 900mil 64-lead though-hole mounted DIP package, row spacing 6.73 mm (264 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 10x-dip-switch SPST , Slide, row spacing 15.24 mm (600 mils), SMDSocket, LongPads 32-lead dip package, row spacing 7.62 mm (300 mils 6-lead surface-mounted (SMD) DIP package, row spacing 8.61 mm (338 mils), body size (see http://www.kingtek.net.cn/pic/201601201417455112.pdf SMD 7x-dip-switch SPST KingTek_DSHP07TS, Slide, row spacing 15.24 mm (600 mils THT DIP DIL PDIP 2.54mm 25.4mm 1000mil Socket 3M 14-pin zero insertion force socket, through-hole, row.
- (http://ww1.microchip.com/downloads/en/DeviceDoc/70593d.pdf), generated with kicad-footprint-generator.
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