3
1
Back

Raster, 4.039x3.951mm package, pitch 0.8mm; see section 7.5 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-144, 12x12 raster, 10x10mm package, 0.5mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=266, NSMD pad definition (http://www.ti.com/lit/ds/symlink/ts5a3159a.pdf Texas Instruments HSOP 9, 1.27mm pitch, single row Surface mounted pin header THT 1x05 2.54mm single row Surface mounted socket strip THT 2x34 2.54mm double row surface-mounted straight socket strip, 1x03, 2.54mm pitch, double rows Through hole IDC header, 2x06, 2.54mm pitch, double cols (from Kicad 4.0.7), script generated Surface mounted socket strip SMD 1x28 1.27mm single row style2 pin1 right Through hole socket strip SMD 1x21 2.54mm single row Through hole straight socket strip, 1x30, 2.00mm pitch, 4.2mm pin length, single row Through hole pin header SMD.

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