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5.24x5.24mm package, pitch 0.4mm; see section 7.1.1 of http://www.st.com/resource/en/datasheet/stm32f401ce.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f091vb.pdf WLCSP-64, 8x8 raster, 3.357x3.657mm package, pitch 0.4mm; see section 7.6 of http://www.st.com/resource/en/datasheet/stm32l072kz.pdf WLCSP-49, 7x7 raster, 2.965x2.965mm package, pitch 0.8mm TFBGA-121, 11x11 raster, 10x10mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.65mm WLP-4, 2x2 raster, 0.73x0.73mm package, pitch 0.4mm; see section 7.4 of http://www.st.com/resource/en/datasheet/stm32f446ze.pdf UFBGA-169, 13x13 raster, 7x7mm package, pitch 0.4mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f411vc.pdf WLCSP-49, 7x7 raster, 2.999x3.185mm package, pitch 0.4mm; see section 7.3 of http://www.st.com/resource/en/datasheet/stm32f042k6.pdf WLCSP-36, 6x6 raster, 2.61x2.88mm package, pitch 0.8mm; see section 6.3 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.4mm; see section 6.8 of http://www.st.com/resource/en/datasheet/stm32f746zg.pdf TFBGA-265, 17x17 raster, 14x14mm package, pitch 0.5mm; see section 7.1 of http://www.st.com/resource/en/datasheet/stm32f401vc.pdf WLCSP-49, 7x7 raster, 3.417x3.151mm package, pitch 0.65mm VFBGA-86, 6.0x6.0mm, 86 Ball, 10x10 Layout, 0.55mm Pitch, https://www.dialog-semiconductor.com/sites/default/files/da1469x_datasheet_3v1.pdf#page=740 VFBGA-100, 10x10, 7x7mm package, pitch 0.4mm; see section 7.5 of http://www.st.com/resource/en/datasheet/DM00257211.pdf WLCSP-49, 7x7 raster, 3x3mm package, pitch 0.6mm; http://ww1.microchip.com/downloads/en/DeviceDoc/39969b.pdf Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=95, NSMD pad definition Appendix A BGA 484 0.8 CLG484 CL484 CLG485 CL485 Artix-7 BGA, 18x18 grid, 15x15mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug865-Zynq-7000-Pkg-Pinout.pdf#page=93, NSMD pad definition Appendix A BGA 900 1 FF900 FFG900 FFV900 FF901 FFG901 FFV901 Artix-7, Kintex-7 and Zynq-7000 BGA, 26x26 grid, 27x27mm package, 1mm pitch; https://www.xilinx.com/support/documentation/user_guides/ug475_7Series_Pkg_Pinout.pdf#page=300, NSMD pad definition (http://www.ti.com/lit/ds/symlink/txs0104e.pdf, http://www.ti.com/lit/an/snva009ag/snva009ag.pdf Texas Instruments (see http://www.ti.com/lit/ds/symlink/lm5118.pdf HSOIC, 8 Pin (http://www.ixysic.com/home/pdfs.nsf/www/IX4426-27-28.pdf/$file/IX4426-27-28.pdf), generated with kicad-footprint-generator ipc_noLead_generator.py Texas QFN, 24 Pin (http://www.ti.com/lit/ds/symlink/bq25601.pdf#page=54), generated with kicad-footprint-generator JST SH series connector, 14111113002xxx (https://b2b.harting.com/files/download/PRD/PDF_TS/1411XX13002XXX_100228421DRW035C.pdf), generated with kicad-footprint-generator Samtec HLE .100" Tiger Beam Cost-effective Single Beam Socket Strip, HLE-123-02-xxx-DV-A, 23 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator ipc_gullwing_generator.py MSOP, 10 Pin (https://www.onsemi.com/pdf/datasheet/nis5420-d.pdf), generated with kicad-footprint-generator JST PUD series connector, 501331-0607 (http://www.molex.com/pdm_docs/sd/5013310207_sd.pdf), generated with kicad-footprint-generator Molex SPOX Connector System, 53047-1410, 14 Pins (http://www.molex.com/pdm_docs/sd/022272021_sd.pdf), generated with kicad-footprint-generator JST ZE series connector, B11B-XASK-1 (http://www.jst-mfg.com/product/pdf/eng/eXA1.pdf), generated with kicad-footprint-generator JST XA series connector, B2B-PH-SM4-TB (http://www.jst-mfg.com/product/pdf/eng/ePH.pdf), generated with kicad-footprint-generator Soldered wire connection, for 4 times 0.1 mm² wires, basic insulation, conductor diameter 1.7mm, size source Multi-Contact FLEXI-E 0.75 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Molex PicoBlade series connector, 78171-0004 (http://www.molex.com/pdm_docs/sd/781710002_sd.pdf), generated with kicad-footprint-generator Soldered wire connection, for 2 times 1.5 mm² wire, reinforced insulation, conductor diameter 1.4mm, outer diameter 2.7mm, size source Multi-Contact FLEXI-E 1.5 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator ipc_noLead_generator.py QFN, 24 Pin (http://www.cypress.com/file/46236/download), generated with kicad-footprint-generator Samtec HLE.

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