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Ipc_noLead_generator.py 32-Lead Frame Chip Scale Package - 4.0x4.0x0.8 mm Body [SOIC], see https://www.mouser.com/ds/2/328/linkswitch-pl_family_datasheet-12517.pdf eSOP-12B SMT Flat Package with Heatsink Tab, see https://ac-dc.power.com/sites/default/files/product-docs/topswitch-jx_family_datasheet.pdf Power Integrations variant of 8-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils), Clearance8mm 8-lead surface-mounted (SMD) DIP package, row spacing 8.89 mm (350 mils), body size 9.78x9.8mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/219.pdf), SMD, LowProfile, JPin SMD 6x-dip-switch SPST , Slide, row spacing 25.4 mm (1000 mils), Socket, LongPads 12-lead though-hole mounted DIP package, row spacing 10.16 mm (400 mils), LongPads 32-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 40-lead though-hole mounted DIP package, row spacing 5.9 mm (232 mils), body size 6.7x6.64mm (see e.g. Https://www.ctscorp.com/wp-content/uploads/206-208.pdf 7x-dip-switch SPST , Slide, row spacing 7.62 mm (300 mils), LongPads 6-lead though-hole mounted DIP package, row spacing 8.89 mm (350 mils), SMDSocket, LongPads 16-lead though-hole mounted.

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