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SOT-93 TO-218-3, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-5, Horizontal, RM 2.54mm TO-251-2, Horizontal, RM 1.27mm, Multiwatt-7, staggered type-1 TO-220-15, Horizontal, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-11, Vertical, RM 4.58mm, IPAK, see https://www.diodes.com/assets/Package-Files/TO251.pdf TO-251-3 Horizontal RM 4.58mm IPAK TO-251-3, Horizontal, RM 2.54mm, see http://ww1.microchip.com/downloads/en/DeviceDoc/20005685A.pdf TO-247-5 Vertical RM 5.45mm TO-3PB-3, Vertical, RM 0.9mm, staggered type-2 TO-220F-15, Vertical, RM 5.45mm, , see http://www.onsemi.com/pub/Collateral/340AC.PDF TO-3PB-3 Vertical RM 5.45mm TO-247-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-11, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220-7 Vertical RM 1.7mm Pentawatt Multiwatt-5 staggered type-1 TO-220F-15, Vertical, RM 5.08mm, see https://www.diodes.com/assets/Package-Files/TO126.pdf TO-126-2 Vertical RM 2.54mm IIPAK I2PAK TO-262-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220F-15, Vertical, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 10.9mm TO-264-3, Horizontal, RM 5.45mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-3 Vertical RM 1.7mm IIPAK I2PAK TO-262-5, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220-11, Horizontal, RM 10.9mm, see https://toshiba.semicon-storage.com/us/product/mosfet/to-247-4l.html TO-247-2 Horizontal RM 2.54mm TO-126-3, Vertical, RM 0.97mm, Multiwatt-9, staggered type-1 TO-220-9, Horizontal, RM 1.27mm, MultiwattF-15, staggered type-1 TO-220F-2, Horizontal, RM 1.7mm, PentawattF-, MultiwattF-5, staggered type-2 TO-220F-11, Vertical, RM 2.54mm, see http://www.vishay.com/docs/88898/b2m.pdf DIL DIP PDIP 2.54mm 15.24mm 600mil Socket 24-lead though-hole mounted DIP package, row spacing 9.53 mm (375 mils 14-lead surface-mounted (SMD) DIP package, row spacing 10.16 mm (400 mils), LongPads 12-lead though-hole mounted DIP package, row spacing 15.24 mm (600 mils SMD DIP DIL PDIP SMDIP 2.54mm 15.24mm 600mil Socket 3M 28-pin zero insertion force socket, through-hole, row spacing 7.62 mm (300 mils), LongPads, see https://www.power.com/sites/default/files/product-docs/tophx_family_datasheet.pdf PowerIntegrations variant of TO-92), also known as TO-226, wide, drill 0.75mm (see NXP SSOP-TSSOP-VSO-REFLOW.pdf and sot510-1_po.pdf TSSOP, 44 Pin (JEDEC MO-153 Var EB https://www.jedec.org/document_search?search_api_views_fulltext=MO-153), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 4 times 0.75 mm² wires, basic insulation, conductor diameter 0.65mm, outer diameter 4.4mm, size source Multi-Contact FLEXI-xV 1.0 (https://ec.staubli.com/AcroFiles/Catalogues/TM_Cab-Main-11014119_(en)_hi.pdf), bend radius 3 times outer diameter, generated with kicad-footprint-generator Fuse SMD 2010 (5025 Metric.

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