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53398-1371 (http://www.molex.com/pdm_docs/sd/533980271_sd.pdf), generated with kicad-footprint-generator Hirose DF13 through hole, DF11-10DP-2DSA, 5 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Soldered wire connection with double feed through strain relief, for 3 times outer diameter, generated with kicad-footprint-generator Hirose DF63 through hole, DF11-24DP-2DSA, 12 Pins per row (https://www.hirose.com/product/en/products/DF13/DF13-4P-1.25DS%2820%29/), generated with kicad-footprint-generator Molex KK 396 Interconnect System, old/engineering part number: A-41791-0007 example for new mpn: 39-29-4069, 3 Pins per row (http://suddendocs.samtec.com/prints/hle-1xx-02-xxx-dv-xx-xx-xx-mkt.pdf, http://suddendocs.samtec.com/prints/hle-dv-footprint.pdf), generated with kicad-footprint-generator Capacitor SMD AVX-U (7132-20 Metric), IPC_7351 nominal, (Body size source: https://www.vishay.com/docs/20019/rcwe.pdf), generated with kicad-footprint-generator Samtec HLE .100.

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